Universal Reballing Device

Main Feature
 

1.Double screw rod and four support slipper move simultaneously( inside or outside) to position the chips,then to adjust to different IC;

2.Self locked structure,liberate you hands, improve efficiency;

3.Double handle and 4 guide pillar make sure the solder ball and the stencil separate easily;

4.special design on solder ball storage- no need to pour out the surplus solder ball;

5.Humanized pour-out groove design, make solder ball pour-out more convenience;

6.Reasonable structure design and beautiful looking,patented product--up to 8 patent protection;